Neusoft Smart Go and GigaDevice have announced that they are to co-develop “more competitive intelligent solutions” for intelligent cockpits, intelligent communication, central computing platforms, cockpit-driving-parking integration and zone controllers.
The strategic cooperation will leverage GigaDevice’s high-performance, highly reliable automotive-grade chips and Neusoft Smart Go’s full-domain technical expertise and mass production experience in upper-body automotive electronics.
As automotive E/E architecture rapidly shifts toward domain centralization and cross-domain integration, deep collaboration between chip vendors and automotive component suppliers has become critical to boost full-vehicle supply chain resilience and speed up cutting-edge hardware deployment, the companies said.
Under the agreement, the two sides will cooperate across three key dimensions: first, deepen the integration of automotive-grade chips and applications, accelerating the full adaptation and large-scale deployment of GigaDevice’s automotive storage and MCUs in Neusoft Smart Go’s in-vehicle product matrix to unlock new collaborative efficiency; second, build a secure and reliable supply chain assurance system, leveraging GigaDevice’s mature mass production capacity and Neusoft Smart Go’s market resources to boost supply chain response efficiency; and third, advance industrial ecosystem cooperation and co-construction, jointly conducting chip access testing, connecting high-quality upstream and downstream resources, and building a safe, collaborative and sustainable intelligent vehicle industry ecosystem.
Jian Guodong, senior vice president of Neusoft Corporation and CEO of Neusoft Smart Go, said, “As automotive E/E architectures keep upgrading, high-performance automotive-grade chips serve as the solid foundation for hardware-software integrated products. Leveraging GigaDevice’s automotive line-up’s extensive mass production experience, this partnership will break traditional supply chain boundaries, to jointly deliver intelligent vehicle hardware-software integrated solutions with stronger competitiveness, safety resilience and self-evolution capabilities for auto makers.”
Li Wenxiong, vice president of GigaDevice and general manager of its automotive business, said, “Neusoft Smart Go is a world-leading provider of full-domain solution for intelligent vehicle upper-body electronics, with deep technical strengths in system-level integration and hardware-software synergy. This strategic cooperation represents a deep tie-up between chips and in-vehicle intelligent system platforms. We will fully utilize our respective strengths to consistently drive the high-quality development of the automotive industry.”
GigaDevice and Neusoft Smart Go said that, going forward, they will leverage this strategic partnership as a key opportunity to “closely align with the evolving E/E architecture trends, and jointly advance the automotive electronics industry’s technological evolution and ecosystem co-construction with a more robust hardware foundation and proven system-level integration capabilities.”
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