Qualcomm Technologies and Hyundai Mobis have announced a collaboration to enhance the High-Performance Computer (HPC) platform. The companies will combine Qualcomm’s Snapdragon Ride Flex System-on-Chip (SoC) and Ride Automated Driving Stack with Hyundai Mobis’s software and sensors for a solution that powers infotainment and ADAS systems.
This means the high-performance processing capabilities and software framework of the Flex SoC can support cockpit, ADAS and automated driving (AD) functionalities on a single chipset. As the functions and software on modern vehicles become more complex, central computers are vital to manage various functions. The Flex SoC is designed to meet this need with its ability to handle flexible workloads. It supports both safety and non-safety critical applications on a single chip.
When paired with Hyundai Mobis’s extensive software and solutions, the system supports advanced cockpit features with integrated instrument clusters, driving and parking solutions and ADAS systems that are based on the Snapdragon Ride Automated Driving Stack.
“We are thrilled to continue our collaboration with Qualcomm Technologies to develop a comprehensive system solution that delivers efficient compute performance while maintaining the highest standards of safety, security and reliability,” said Soo Kyung Jung, executive vice president and head of the automotive electronics business unit at Hyundai Mobis.
“Our work with Hyundai Mobis is dedicated to providing integrated automotive solutions that meet and exceed auto maker and their customer needs,” said O H Kwon, senior vice president and president, APAC, at Qualcomm. “With the Snapdragon Ride Flex SoC, we are making SDV technology accessible and more cost-effective for auto makers to embrace the transition to an integrated, open and scalable architecture across all their vehicle segments,” he said.
