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Computing

Infineon Technologies partnering with MediaTek for AI-driven in-cabin experience

Matt RossBy Matt RossAugust 12, 20262 Mins Read
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Infineon Technologies partnering with MediaTek for AI-driven in-cabin experience

MediaTek has now qualified the Infineon 512 Mb Quad SPI NOR Flash, an automotive-grade NOR Flash memory solution, for use in its Dimensity Auto Cockpit platform C-X1, making the Infineon device an approved and easily adoptable memory option for automotive OEMs, Tier-1 suppliers, and design partners.

“Automotive memory is a strategic enabler of innovation as software-defined vehicles depend on high-performance Systems-on-Chip (SoCs), increasingly complex firmware, and large data stores,” said Rainer Hoehler, senior vice president, memory solutions at Infineon Technologies. “Cutting-edge digital cockpits and over-the-air update capabilities are driving the demand for higher density NOR flash. With the qualification by MediaTek, customers can now easily integrate Infineon’s 512 Mb NOR Flash as a future‑ready memory solution for smart cockpits.”

“Infineon’s automotive-grade NOR Flash delivers the performance, reliability, and functional safety features required for our premium and high-end Dimensity Auto Cockpit platform C-X1,” said Mike Chang, MediaTek vice president and auto business general manager. “Its high-density design enables the advanced AI and user-experience capabilities that will be essential in next-generation software-defined vehicles. Building on our long-standing collaboration, we leverage Infineon’s industry leadership to deliver a reliable backbone for the evolving software-defined ecosystem.”

Infineon’s 512 Mb QSPI NOR Flash memory stores the firmware and boot code required to facilitate AI-driven features at the SoC level, such as voice assistants, driver monitoring, travel vlog generation, environmental perception, and personalized audio-visual recommendations. It also provides critical redundancy for enhanced safety. Built on Infineon’s MirrorBit technology, it offers a robust interface, broad compatibility with leading Automotive SoCs, AEC-Q100 qualification, and operating temperature support up to +125°C.

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