Connected vehicle solutions provider Harman has announced the launch of the Ready Connect 5G telematics control unit (TCU), leveraging Qualcomm’s Snapdragon Digital Chassis technology.
Based on the Snapdragon Auto 5G Modem-RF Gen 2, the Harman Ready Connect 5G TCU is designed to advance automotive connectivity, offering “rich in-cabin experiences for consumers while reducing engineering efforts for OEMs”, the company states. The TCU is currently available and is being showcased this week at Mobile World Congress (MWC) 2024 in Barcelona, Spain.
Harman says that, through the Snapdragon Modem-RF Gen 2 system, the TCU offers connectivity performance while maximizing upgradability, scalability and usability.
Pascal Peguret, SVP – connectivity for Harman Automotive, said, “The Ready Connect 5G TCU product is a testament to that shared vision, disrupting the traditional TCU approach as an off-the-shelf TCU product. Harman Ready Connect 5G TCU is designed to meet the needs of auto makers simply and effectively while expediting the time to market and significantly reducing development cost.”
Jeff Arnold, VP of product management at Qualcomm, said, “As pioneers in wireless technologies, Qualcomm Technologies is pleased to further strengthen our longstanding relationship with Harman to help bring the Ready Connect 5G TCU to the industry.
“This product exemplifies our dedication to driving connectivity innovation in the automotive industry, delivering a seamless combination of performance, reliability and features through the utilization of our Snapdragon Modem-RF Gen 2 system.”
