Infineon Technologies has introduced eight new solutions to its Bluetooth portfolio in the Airoc CYW20829 Bluetooth Low Energy 5.4 microcontroller (MCU) family, featuring systems-on-chips (SoCs) and modules designed for industrial, consumer and automotive use cases.
The latest automotive part in the product family, the Airoc CYW89829 Bluetooth Low-Energy MCU, can be used for car access and wireless battery management systems (wBMS) applications, due to its radio frequency (RF) performance, long range and Bluetooth 5.4 features including PAwR (Periodic Advertising with Responses). The dual ARM Cortex core design of the chip family features separate application and Bluetooth low-energy subsystems that deliver full featured support for Bluetooth 5.4, low-power, 10dBm output power without a PA, integrated flash, CAN FD, crypto accelerators and high security including root of trust (RoT), as well as being PSA level 1 ready.
Shantanu Bhalerao, vice president of the Bluetooth product line at Infineon Technologies, said, “Our automotive Airoc CYW89829 Bluetooth LE MCU and versatile AIROC Bluetooth CYW20829 LE MCU deliver ultra-low power and a high degree of integration for a better user experience across various applications in automotive, industrial and consumer markets.”
According to Infineon, the high integration of the CYW20829 product family enables designers to reduce bill-of-material (BOM) cost and device footprint in a wide variety of applications, including PC accessories, low-energy audio, wearables, solar micro inverters, asset trackers, health and lifestyle, home automation and others.
“The Infineon CYW20829 is the leading Bluetooth part in the market, which has passed the latest Bluetooth 5.4 certification,” said Kevin Wang, CEO of ITON. “CYW20829 has very good RF performance, supports PAwR and LE Audio. These features bring more possibilities in consumer and industrial markets.”
