Connectivity solutions provider Valens Semiconductor has been selected by LG Vehicle Component Solutions (VS) Company to provide its VA7000 MIPI A-PHY chipset range for LG’s next-generation camera system project, which is expected to come to fruition in 2026.
The Valens chipsets will be used as the underlying connectivity solution between multiple camera sensors and LG VS’s camera system. This will result in the seamless display of multifunctional information to augment driver decision making while also improving passenger safety.
“Valens Semiconductor’s partnership with the LG VS Company is a clear testament to our shared vision to provide unmatched high-performance solutions for the automotive industry,” said Gideon Kedem, senior vice president and head of automotive at Valens Semiconductor. “Today’s announcement demonstrates the execution of Valens Semiconductor’s strategy to develop disruptive and standardized high-performance connectivity solutions. It is a key milestone toward mass production of our VA7000 MIPI A-PHY compliant chipsets that will enable high-performance ADAS connectivity solutions in a multi-billion addressable market.”
“After having examined alternative connectivity solutions on the market, we decided to join hands with Valens Semiconductor to deploy its VA7000 MIPI A-PHY chipsets in the LG VS Company’s next-generation camera system, which is part of our Digital Cockpit Electronics. The VA7000 feature set and excellent EMC capabilities have been pre-validated by both companies, and they are collaborating for mass-production application,” said Juneun Park, vice president of head unit development at LG VS Company. “We expect this groundbreaking offering to be ready for mass production for automotive OEMs in 2026 and are looking forward to further expanding our collaboration toward broad adoption of the MIPI A-PHY standard.”
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