Intel has unveiled the second-generation Intel AI-enhanced software-defined vehicle (SDV) system-on-chip (SoC), the automotive industry’s first multiprocess node chiplet architecture, at Auto Shanghai 2025. Engineered to meet the growing demands of intelligent, connected vehicles, the new SoC aims to provide auto makers with scalable performance, advanced AI capabilities and optimized cost-efficiency.
Intel has also announced new strategic collaborations with automotive innovators ModelBest and Black Sesame Technologies to accelerate innovation in AI-powered cockpits, integrated ADAS solutions and energy-efficient vehicle compute platforms.
“Intel is redefining automotive compute with our second-generation SDV SoC, combining the flexibility of chiplet technology with our proven whole-vehicle approach. Together with our partners, we’re solving real industry challenges, from energy efficiency to AI-driven experiences, to make the software-defined vehicle revolution a reality for all,” said Jack Weast, Intel fellow, and vice president and general manager of Intel Automotive.
Intel’s chiplet-based architecture
The second-generation Intel SDV SoC leverages a multinode chiplet architecture, enabling auto makers to tailor compute, graphics and AI capabilities to their needs while reducing development costs and accelerating time-to-market. By combining best-in-class silicon for each functional block, the architecture offers up to 10x AI performance for generative and multimodal AI; up to 3x graphics performance for richer human-machine interface (HMI) experiences; and 12 camera lanes for increased camera input and image processing capabilities.
Collaborations with automotive innovators
The collaborations announced at Auto Shanghai include working with ModelBest‘s GUI Intelligent Agent, bringing a true on-device LLM to life, powered by Intel’s SDV SoC and Intel Arc graphics, enabling offline, AI-enhanced voice control and personalized interaction, even without network connectivity. The agent enhances voice interaction by accurately understanding natural language in complex situations, ensuring an intuitive cockpit experience. This collaboration leverages ModelBest’s success with Intel’s AI PC acceleration program, optimizing AI for a seamless out-of-the-box experience on Intel’s automotive platform.
Additionally, Black Sesame is developing a central computer platform that fuses ADAS and immersive cockpit experiences, combining its ADAS technology with Intel’s SDV SoC and Intel Arc graphics for automotive.
In related news, Lenovo, a global technology company, announced a strategic partnership with Toyota Boshoku, a manufacturer of automotive interior systems, commencing in April 2025. Click here to read the full story.
