LG Innotek is expanding into the automotive semiconductor market with a new product, the Automotive Application Processor Module (AP Module). This component is designed for vehicles and marks a step forward in the company’s growing electronic components business.
Automotive AP modules are semiconductor components that help manage and integrate electronic systems in vehicles, such as ADAS and digital cockpits. They function like a car’s brain, similar to how a CPU powers a computer. As connected cars evolve with features like autonomous driving, the demand for AP modules is growing rapidly. Traditional PCB-based semiconductor chips can’t keep up with the massive data processing needs of advanced ADAS, high-resolution displays and digital cockpits.
According to LG Innotek, its Automotive AP Module stands out for its compact size. Measuring 2.5 x 2.5in, it features over 400 components, including a memory semiconductor, power management integrated circuit (PMIC) and an integrated chipset (SoC). This chipset handles key functions such as data and graphics processing, display output and multimedia control.
By using this module, auto makers can reduce motherboard size, enabling more flexible designs. The shorter signal distance between tightly integrated components also improves control performance.
LG Innotek plans to keep enhancing the module, focusing this year on better heat dissipation – enabling it to operate at up to 95°C – and speeding up development by using virtual simulations to predict warpage.
The company is currently marketing the product to global semiconductor firms, particularly in North America, with hopes of starting mass production in the second half of the year.
Moon Hyuksoo, CEO of LG Innotek, commented, “The development of Automotive AP modules has enabled us to accelerate the expansion of our semiconductor components business. LG Innotek will continue to develop products that deliver unique customer value and establish itself as a reliable technology partner for its global customers.”
