OmniVision Technologies has unveiled the world’s first automotive wafer-level camera, the OVM9284 CameraCubeChip module.
The 1MP module measures 6.5×6.5mm, giving designers greater flexibility to place driver monitoring systems in the cabin.
It is built on OmniVision’s OmniPixel 3-GS global-shutter pixel architecture, and the integrated OmniVision image sensor has a 3 micron pixel and 1/4in optical format with 1280×800 resolution.
CameraCubeChip modules are reflowable so they can be mounted to a printed circuit board simultaneously with other components using automated surface-mount assembly equipment.
Mass production of the OVM9284 is expected to start in Q4 of 2020.